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Samsung Develops 1TB Storage for Phones

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Samsung Develops 1TB Storage for Phones

Samsung claims to be the first to break the terabyte threshold for smartphone storage-- specifically by starting mass production of a 1TB embedded Universal Flash Storage (eUFS) 2.1 chip.

Designed for next-generation mobile applications, the 1TB chip comes just 4 years after the introduction of the first UFS solution, the 128GB eUFS. The 1TB eUFS solution has the same package size (11.5 x 13mm) as previous chips, but doubles the capacity of the 512GB version by combining 16 stacked layers of 512-gigabit V-NAND flash memory and a proprietary controller. The result, Samsung says, provides enough space to store 260 10-minute videos in 4K (3840 x 2160) resolution.

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WD Adds Heatsink to Black SN750 SSD

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WD Adds Heatsink to Black SN750 SSD

Western Digital (WD) announces an update of the Black gaming-oriented SSD range-- the Black SN750 NVMe SSD not only offers up to 2TB of storage, but also features an integrated heatsink for optimal performance.

Available in a single-sided M.2 form factor, the SN750 is largely identical to the original, if with tweaks on both the firmware and hardware side. As such, performance tops out on the 1TB model at 3470MB/s sequential read and 3000MB/s sequential write.

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Lexar Claims 1TB SD Card

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Lexar Claims 1TB SD Card

Lexar announces an SDXC card with storage capacity reaching no less than 1TB-- the Professional 633x, an SDXC card leveraging the limit of UHS-I technology for transfers reaching up to 95MB/s (class 10).

The Professional 633x is technically not the first SDXC card with 1TB capacity. That honour belongs to an unnamed SanDisk prototype unveiled back at PhotoKina 2016. However the SanDisk card never made it to market, and as such one can describe the Lexar card as the first to actually become a commercial product.

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Stylish LaCie Storage at CES 2019

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Stylish LaCie Storage at CES 2019

LaCie takes to CES 2019 with a range of external storage solutions aimed at data-hungry customers, including the 2019 Mobile Drive, Mobile SSD and Backup Plus Ultra Touch.

The 2019 version of the Mobile Drive is an external HDD in capacities ranging from 2 to 5TB. It features a USB-C interface, and comes inside a newly designed aluminium enclosure with an "eye-catching diamond-cut" design. The Mobile SSD features a similar design and USB-C interface, only with up to 2TB of faster solid state storage. Both include a 1-month subscription to Adobe Creative Cloud, and the LaCie Toolkit software for backup/mirroring purposes.

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Up to 4TB in Samsung 860 QVO SSDs

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Up to 4TB in Samsung 860 QVO SSDs

Customers wanting more storage from their SSD purchases should be satisfied with the Samsung 860 QVO-- an SSD line offering up to 4TB capacity through the use of high-density 4-bit MLC NAND flash technology.

“Today’s consumers are using, producing and storing more high-resolution files than ever, including 4K videos and graphics-intensive games, escalating demand for greater capacities and performance in storage devices,” the company says. “Samsung continues to lead the move toward multi-terabyte SSDs with the introduction of the Samsung 860 QVO, delivering fast performance, reliability and value to more consumers around the world.”

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SK Hynix Claims First 96-Layer 4D NAND Flash

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SK Hynix Claims First 96-Layer 4D NAND Flash

SK Hynix presents the first 96-layer 512Gb CTF-based 4D NAND flash based on TLC (Triple-Level Cell) arrays using a 3D CTF (Charge Trap Flash) design paired with PUC (Periphery Under Cell) technology.

A single 512Gb NAND flash chip can represent up to 64GB of storage. As the company puts it, the combination of 3D CTF with PUC is an industry first, and allows for the finest performance and productivity yet.

The 4D NAND chip also reduces chip size by 30% and increases bit productivity per wafer by 49% compared to current 72-layer 512Gb 3D NAND, and offers 30% higher write and 25% higher read performance. Data bandwidth clocks at 64KB, and a multiple gate insulator architecture allows for data I/O speeds reaching 1200Mbps at 1.2V operation power.

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Micron Buys Intel Stake in Joint Venture

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Micron Buys Intel Stake in Joint Venture

Micron acquires the Intel stake in IM Flash Technologies (IMFT), a joint venture in the development of flash-based storage and owner of the only facility producing 3D XPoint technology.

"Micron's acquisition of IM Flash demonstrates our strong belief that 3D XPoint technology and other emerging memories will provide a unique differentiator for the company and be an essential solution for new data-hungry applications," the company says. "This investment provides Micron with an established development and manufacturing facility and a highly skilled workforce with a strong track record of innovation and execution."

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More Secure Storage With Lexar JumpDrive Fingerprint F35

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More Secure Storage With Lexar JumpDrive Fingerprint F35

The Lexar JumpDrive Fingerprint F35 is a USB 3.0 flash drive with a fingerprint reader customers can set with up to 10 different people, as well as 256-bit AES encryption to ensure the security of files.

Available in 32, 64, 128G and 256GB capacities, the JumpDrive Fingerprint F35 offers read speeds reaching up to 150MB/s and is compatible with both Windows and Mac PCs. It also promises the fingerprint reader takes less than 1 second to recognise a user, with included software providing means for password, fingerprint and user management.

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Kingston Presents HyperX Savage EXO Portable SSD

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Kingston Presents HyperX Savage EXO Portable SSD

Kingston adds a pair of SSDs to the HyperX storage lineup-- the Savage EXO portable SSD and the Fury RGB SSD, both promising faster storage through the use of 3D NAND technology.

The Savage EXO SSD is available in 480 or 960GB capacities, and offers read speeds of up to 500MB/s and write speeds of 400MB/s. It comes in a compact form factor measuring 123.82 x 48.61 x 10.24mm and weighing just 56g, and is compatible with Windows and Mac PCs as well as Xbox One and PS4 consoles. Connectivity comes via USB-C interface.

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