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Memory

SK Hynix Intros HBM2E Memory

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SK Hynix Intros HBM2E Memory

SK Hynix announces a High Bandwidth Memory (HBM) update-- HBM2E DRAM promising "the industry's highest bandwidth" in the shape of a 50% bandwidth increase and 100% additional capacity over the previous HBM2.

According to the company, HBM2E supports bandwidth reaching over 460GB per second, based on 3.6Gbps performance per pin with 1024 data I/Os. TSV (Through Silicon Via) technology allows the vertical stacking of a maximum of eight 16Gb chips, creating a single, dense package with 16GB data capacity.

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G.Skill Boosts Trident Z Neo Memory Kits

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G.Skill Boosts Trident Z Neo Memory Kits

Taiwanese memory maker G.Skill announces the "extremely low latency" Trident Z Neo series DDR4-3800MHz CL14 RGB memory kits, available in 16GB (8GBx2) and 32GB (8GBx4) capacities for the AMD Ryzen 3000 series CPU and X570 platform.

Built using select Samsung B-die memory chips and a custom PCB, the memory kits run at 3800MHz with up to 58GB/s bandwidth, allowing customers to "push the limits" on the AMD Ryzen 3000 platform. The unbuffered DIMMs come with aluminium heat spreaders and, as typical of hardware aimed at the gamer market, RGB LEDs.

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G.Skill Optimises Trident Z Neo For Ryzen 3000 Series

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G.Skill Optimises Trident Z Neo  For Ryzen 3000 Series

Performance PC memory maker G.Skill announces a DDR4 memory series for use with the AMD Ryzen 3000 series CPUs on the X570 platform-- the Trident Z Neo, with optimised specifications within a sleek dual-tone heatspreader design.

The Ryzen 3000 series platform handles memory speeds of up to DDR4-5774MHz, the fastest achieved on an AMD platform (if under extreme liquid nitrogen cooling). G.Skill claims the Trident Z Neo is engineered to "achieve optimal performance" on the platform, with frequency speeds reaching DDR4-3600 at CL14-15-15-35 timings at 1.4V during tests using an X570-based motherboard with a 6-core Ryzen 5 3600 processor.

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TrendForce: US-China Trade War Affects DRAM Prices

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TrendForce: US-China Trade War Affects DRAM Prices

DRAM prices are set to further drop in Q3 2019, the DRAMeXchange division of TrendForce warns-- the US ban of Huawei is to affect peak-season demand for DRAM products, leading to a price drop of -10-15%.

According to the analyst, a heated US-China trade war may send H2 2019 DRAM demand in "quick-freeze," with increasing uncertainty leading datacentres to make reductions to capex. As a result, DRAM suppliers may end up having to write off excessive inventories by end 2019, essentially putting themselves in the red.

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GeiL Memory for SFF PCs

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GeiL Memory for SFF PCs

GeiL borrows the Phantom Gaming brand from ASRock with the Evo Spear Phantom Gaming Edition memory-- modules designed for use in small form factor PCs, especially those featuring Phantom Gaming Z390 motherboards.

The Evo Spear Phantom Gaming memory modules come in DDR4-2400, DDR4-2666, DDR4-3000 and DDR4-3200 versions, with latencies ranging from CL17-19. The lower end modules run at voltages of 1.2V, while the higher-spec modules run at 1.35V. The kits also include an XMP 2.0 profule for one-click overclocking, and individual stick capacity reaches up to 16GB.

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