SK Hynix announces a High Bandwidth Memory (HBM) update-- HBM2E DRAM promising "the industry's highest bandwidth" in the shape of a 50% bandwidth increase and 100% additional capacity over the previous HBM2.
According to the company, HBM2E supports bandwidth reaching over 460GB per second, based on 3.6Gbps performance per pin with 1024 data I/Os. TSV (Through Silicon Via) technology allows the vertical stacking of a maximum of eight 16Gb chips, creating a single, dense package with 16GB data capacity.
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