G.Skill adds high-capacity, high-performance specifications based on 32GB modules to a number of memory series, available in dual- and quad-channel kits offering data transfer rates from 2666MT/s to 4000MT/s.

Memory series getting the 32GB modules include the Trident Z Royal DDR4-3200 CL16 256GB (32GBx8), Trident Z Royal DDR4-4000 CL18 128GB (32GBx4), Trident Z Neo DDR4-3600 CL18 128GB (32GBx4), and Trident Z Neo DDR4-3800 C18 64GB (32GBx2). Based on pre-binned 16Gb chips and proprietary PCBs, the lower-end modules are available as single pieces while the higher-end options are available as dual- and quad-channel kits for high-end desktops and workstations.

The UDIMMs feature an XMP 2.0 SDP for setting speeds beyond JEDEC. The highest-performing kits for AMD Ryzen 3000-based PCs are the 64GB DDR4-3800 CL18 and the 128GB DDR4-3600 CL18. Intel users get the 128GB DDR4-4000 CL18 and the 256GB DDR4-3200 CL16. Currently AMD validation involves the MSI MEG X570 Godlike motherboard, whereas Intel validation is on the ASUS ROG Rampage VI Extreme Encore motherboard.

The enthusiast-class G.Skill 32GB unbuffered DIMMs feature aluminium heat spreaders with an RGB lightbar with multiple lighting zones. The Trident Z Royal kits have polished silver or gold heat spreaders and a crystalline RGB lightbar, while the Trident Z Neo feature matte heat spreaders and an RGB lightbar.

All the above mentioned G.Skill memory kits ship on Q3 2019.

Go G.Skill Releases New DDR4 32GB Module Specs with Memory Kits Up to 256GB