Visit our other websites:    On CE ... eSP ... Mobile Channels ... ECI news ... rAVe Europe ... Digital Signage News EMEA

Memory

3D Memory Stacking From Samsung

E-mail Print PDF
3D Memory Stacking From Samsung

Samsung stacks memory chips on top of each other in its new 8GB DIMM and increases memory density by 50% (compared to conventional DIMM technology)

The new registered or buffered (RDIMM) product is based on Samsung's own Green DDR3 DRAM and 40nm circuitry.

The industry refers to the process as through silicon via (TSV). It creates vertical micron-sized holes through the chip silicon (instead of just horizontal) to create a denser architecture.

Samsung says the technology saves up to 40% of power Continue reading...

Micron Goes After NAND Memory Errors

E-mail Print PDF
Micron Goes After NAND Memory Errors

Micron integrates error management techniques with its NAND products with ClearNAND.

As semiconductor circuity shrinks, data error rates increase, calling for more sophisticated error correction code (ECC).

ClearNAND eliminates the ECC burden from the host processor through an application-specific integrated circuit (ASIC) and an 8 byte capacity NAND die acting a data collection cache.

The ClearNAND itself appears as a standard NAND interface to the host processor.

Micron uses its 25nm MLC process Continue reading...

DRAM Prices To Fall Through 2011

E-mail Print PDF
DRAM Prices To Fall Through 2011

DRAMeXchange reports DRAM prices are to keep falling through 2011's first half before eventual recovery.

The market researcher predicts 2GB DDR2 module prices will fall to $20 by 2010's end. Prices already fell by 24% this year, from a peak of $46.50 in first half 2010 to $25 in November 2010's first half.

Low PC sales (due to shaky consumer confidence), together with increased production from DRAM producers combine to make prices fall down even further.

DRAMeXchange mentions Samsung's increased Continue reading...

Strong Embedded NAND Flash Growth Continues

E-mail Print PDF
Strong Embedded NAND Flash Growth Continues

Trendforce's DRAMeXchange predicts the strong growth in embedded NAND flash to continue through 2011, thanks to the smartphone and tablet PC markets.

NAND Flash demand for embedded systems reaches 40% of the memory market in 2010, and will grow up to 63% in 2011. The diversification to system products should help ease the impact on the memory card and UFD market section.

Handsets will make over 40%  of total NAND flash consumption, while the growing tablet PC will take over 10%.

The UFD market Continue reading...

Lexar Media on the State of Memory

E-mail Print PDF
Lexar Media on the State of Memory

Due to the economic crisis, NAND and DRAM supply is limited but demand is high, says Lexar Media EMEA Marketing Director Saul Matthews. With lot of manufacturer capacity offline, prices increased over 200% in the past last 2 years.

Crucial

Lexar urges its business partners to create value-added solutions for their customers, such as software trials and discounts or automatic backup and encryption solutions

With its Crucial brand, Lexar also pushes SSD technology. The company's C300 range matches HDD Continue reading...

SuperTalent Celebrates With Gold

E-mail Print PDF

The special edition Pico-C crams not only 64GB capacity but also 24K gold plating.

Pico-C Special Edition

This ups the capacity of SuperTalent's Pico-C flash drives.

The manufacturer describes its Pico-C drives as "the smallest in the world" - the size of a fingertip and weighing less than 6g.

Go SuperTalent Pico-C Special Edition

Kingston Launches First Water-cooled DDR3

E-mail Print PDF
Kingston Launches First Water-cooled DDR3

Kingston releases its first water-cooled DDR3 memory kit for PCs.

The HyperX H2O water cooled DDR3 line features three products: two 4GB dual-channel kits with 2000MHz or 2133MHz frequencies & a 6GB triple channel kit running at 2000 MHz.

Water-cooling feature aids quieter operation and reliability. Kingston says water-cooled DRAM runs consistently 10-14 degrees cooler than air-cooled.

"The original HyperX module will now be called Genesis,” says Vincent Kim, HyperX product manager, Kingston. “T Continue reading...

DRAM Prices Rise in 2010, Says Elpida

E-mail Print PDF
DRAM Prices Rise in 2010, Says Elpida

DRAM industry will see higher prices per chip this year than in the last three years, says Japan's Elpida Memory.

Elpida will spend US$1 billion on new production lines and transfer chip production technology as fine as 40 nanometers and even 35 nm to its new Taiwanese partner, ProMOS Technologies (so the company can produce DDR3 on behalf of Elpida).

Elpida thinks demand for DRAM in 2010 may still rise 50% while supply will only increase 40%.

Most DRAM makers have been selling chips at a loss Continue reading...

World's Highest Single-die Memory Device

E-mail Print PDF

8GB and 16GB SDHC cards Based on 43nm process technology, the 64Gb NAND flash chip (the highest-density single-die memory device in the world) enters production, reports SanDisk.

SanDisk developed a 4-bit-per-cell X4 memory stick, twice as many as the cells in conventional multi-level cell (MLC) NAND (2-bits-per-cell) memory chips.

SanDisk ships 8GB and 16GB SDHC cards using X4 technology as well as 8GB and 16GB Memory Stick Pro Duo cards.

Go X4 Memory Stick

Page 13 of 14