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Samsung Intros Portable SSD T5

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Samsung announces a successor to the Portable SSD T3-- the Portable SSD T5, with transfer speeds leveraging on the USB 3.1 gent 2 interface to reach up to 540 MBps.

Samsung Portable T5The T5 is a small device measuring around the size of a business card. It weighs 51g, offers up to 2TB capacity and includes AES 256-bit hardware encryption to ensure the protection of sensitive data. Also included is Dynamic Thermal Guard Protection technology, which monitors and manages operating temperature in order to reduce overheating.

The "Bothie" Taking Nokia 8

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HMD Global hopes to introduce a new word with the launch of the Nokia 8, its first Nokia-branded Android flagship-- "bothie," or a photo taken by both front and rear cameras, simultaneously.

Nokia 8Attempts at terminology aside, the Nokia 8 is the Finnish company's take on the likes of Apple and Samsung. It is a 5.3-inch device with an aluminium unibody, inside of which are a 2560 x 1440 resolution LCD display, Snapdragon 835 processor, 4GB RAM, 64GB storage (expandable to 256GB via microSD card) and a 3090mAh battery. The software of choice is stock Android 7 (aka Nougat).

MSI Launches X2999M Gaming Pro Carbon AC

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MSI announces a Micro ATX motherboard addition to the X2999 series-- the X2999M Gaming Pro Carbon AC, essentially a smaller version of the ATX-sized X299 Gaming Pro Carbon Pro.

MSI X2999MLike its larger sibling, the X2999M features a similar I/O cover shape with a painted carbon pattern on the black board. It also offers dual "Steel Armor" PCIe x16 slots for multi-GPU builds, eight SATA ports, dual M.2 slots and the same 10-phase DrMOS PWM. The four DIMM slots handle up to 128GB of 4200MHz quad-channel DDR4 RAM.

On the processor side it supports Intel Core X-series i7 and i9 socket 2066 processors. Further features include dual Intel gaming LAN and wireless network support, dedicated water pump PIN header, MSI OC Engine 2 external clock generator, and Clear CMOS and Flashback+ buttons on the rear I/O panel.

Lian Li Announces PC-Q39 Tempered Glass Chassis

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PC case maker Lian-Li presents the PC-Q39-- a Mini-ITX tower chassis featuring aluminium construction and a full-cover tempered glass side panel users can attach to the frame via thumbscrews.

PC-Q39A successor to the PC-Q37 chassis, the PC-Q39 allows use of ATX power supplies, as well as triple-slot graphics cards. The main compartment has a dual-chamber design separating motherboard, processor and graphics card from the power supply, HDDs and water cooling components.

Dedicated internal grommets for liquid cooling tubing allow users to move reservoir and pumps to the wider secondary chamber, allowing users to show off the main components behind the tempered glass panel. A large hole in the motherboard mounting plate behind the CPU socket area facilitates heatsink changes without need for motherboard removal.

Intel Readies for the Future With Ice Lake

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Intel might still have to officially the 8th generation of Core architecture, code named Coffee Lake, but it has already revealed details of the next generation-- Ice Lake.

Intel chipDescribed as the "successor the 8th generation Intel Core processor family," Ice Lake processors will be built using a 10nm+ process. This is perhaps an odd move, since Chipzilla is still to officially detail the first 10nm Core architecture, Cannon Lake. It also throws a spanner in what is a confusing naming convention, what with Kaby Lake (14nm+), Coffee Lake (14nm++),  Cannon Lake (10mm) and now Ice Lake (10nm+).

Chipzilla originally hoped to move to a 10nm process by the end of 2016, 2 years after the launch of the 14nm process. However the technology proved more challenging than expected, probably due to a yield rate not high enough for the company. According to Anandtech, the process also depends on die size, with the first products using it being designed for smaller mobile applications (since yields for smaller parts are better than larger parts at the same defect rate).

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